Transforming AI with ASUS Solutions Powered by AMD EPYC 9005 and Instinct MI325X accelerators Gaylord Contreras | usagoldmines.com

Pioneering AI supercomputing on the 2024 OCP International Summit

New AMD AI servers: ASUS ESC A8A-E12U server with AMD EPYC 9005 processors and MI325X accelerators, and RS520QA-E13, a 2U4N general-purpose server for cloud
Intel®-based AI options: Highlights embrace RS720-E12 powered by Intel® Xeon® 6 processors and ESC I8-E11 with Intel® Gaudi 3 accelerators
Session on modular structure: Be a part of ASUS session on October 16, 10:20-10:35, on the Information Middle Modular {Hardware} System (DC-MHS) and its influence on server design

Taipei, Taiwan, October 14, 2024 — ASUS is happy to take part within the 2024 OCP International Summit, happening from October 15-17 on the San Jose Conference Middle, at sales space #A31. With practically 30 years of expertise within the server {industry}, ASUS has a wealthy historical past of collaboration with cloud-service suppliers, starting in 2008 with the design of server motherboards for main cloud information facilities. Constructing on this robust basis in motherboard experience, ASUS has developed a complete lineup of AI servers that shall be showcased on the summit, underscoring our dedication to advancing AI and information middle applied sciences.

Elevate AI with AMD EPYC 9005 and Intuition MI325X accelerators

ASUS is debuting its newest fashions powered by AMD EPYC 9005 processors. Main the lineup is the ASUS ESC A8A-E12U, a 7U server geared up with twin AMD EPYC 9005 processors and eight AMD Intuition MI325X accelerators. The MI325X affords an industry-leading 256GB of high-bandwidth reminiscence (HBM) capability and as much as 6TB/s HBM bandwidth, making it completely suited to inference and fine-tuning of huge AI fashions and HPC workloads. Moreover, it helps direct GPU-to-GPU interconnects and a one-GPU-to-one-NIC topology, with as much as eight 400G NICs for distinctive efficiency and scalability We’ll even be showcasing ASUS 8000A-E13P, a 4U server powered by twin AMD EPYC 9005 processors, supporting as much as eight double-slot GPU playing cards (as much as 600W) with the flexibleness to accommodate a full vary of GPUs for numerous AI functions. Totally compliant with the NVIDIA® MGXTM structure, it’s designed for speedy deployment in large-scale enterprise AI infrastructures. Configured with an NVIDIA 2-8-5 topology (CPU-GPU-DPU/NIC) and 4 high-bandwidth PCIe® NICs, it enhances east-west site visitors and total system efficiency.

We’re additionally introducing ASUS RS520QA-E13, a 2U four-node, high-density server particularly designed for the cloud and the digital design automation (EDA) phase. Every node is supplied with an AMD EPYC 9005 processor and two Compute Categorical Hyperlink (CXL) reminiscence enlargement modules, providing a complete of 12 + 8 DIMM expandability for top reminiscence capability and pace. With distinctive thermal efficiency supporting as much as 400W TDP by environment friendly air-cooling, the RS520QA-E13 ensures optimum operation. Its all-front-access format simplifies upkeep, enhancing person comfort.

Increasing AI horizons with Intel Xeon 6 and Gaudi 3 accelerators ASUS may even spotlight its highly effective Intel®-based options. ASUS RS720-E12, a 2U server powered by Intel Xeon 6 processors, options the OCP DC-MHS modular structure, providing flexibility and effectivity for numerous information middle wants. Its GPU-optimized design helps as much as three dual-slot GPUs, making it best for AI workloads and machine studying duties.

For prime-end AI functions, ASUS ESC I8-E11 is strong 7U server powered by twin fifth Gen Intel Xeon Scalable processors and able to accommodating eight Intel Gaudi 3 accelerators. This powerhouse delivers distinctive efficiency for essentially the most demanding workloads, together with generative AI, deep studying, machine studying, information evaluation, and scientific analysis. Its modular design minimizes cable utilization, decreasing meeting time and enhancing thermal optimization for improved total effectivity.

Be a part of the ASUS 2024 OCP International Summit session on modular server structure

Do not miss the 15-minute ASUS session on the 2024 OCP International Summit on October 16 from 10:20 to 10:35, the place we are going to discover the way forward for modular server structure with an introduction of Information Middle Modular {Hardware} System (DC-MHS) developed by OCP. Uncover how this modern structure is remodeling server design, providing unprecedented flexibility, simplified upkeep and environment friendly scalability for contemporary information facilities.