By Nermeen Nabil Khear 
In 2025, Apple is planning to debut a thinner model of the iPhone that might be offered alongside the iPhone 17, iPhone 17 Professional, and iPhone 17 Professional Max. This iPhone 17 “Air” might be about two millimeters thinner than the present iPhone 16 Pro, in keeping with Bloomberg‘s Mark Gurman.
The iPhone 16 Professional is 8.25mm thick, so an iPhone 17 that’s 2mm thinner would are available in at round 6.25mm. At 6.25mm, the iPhone 17 Air can be Apple’s thinnest iPhone up to now. The thinnest iPhone we have seen up to now was the iPhone 6, which measured in at 6.9mm. iPhones bought thicker with the iPhone X and past, as Apple elevated thickness to supply extra space for the battery, digicam lenses, Face ID {hardware}, and extra.
Apple will equip the iPhone 17 Air with its personal custom-designed 5G modem chip, and that chip is smaller than 5G modem chips from Qualcomm. Gurman says that Apple centered on making the chip extra built-in with different Apple-designed parts to save lots of house inside the iPhone, and that house financial savings is what allowed it to create the slimmed down iPhone 17 Air with out sacrificing battery life, the digicam, or the show high quality.
Prior rumors have also suggested that the iPhone 17 Air might be someplace between 5mm and 6mm thick, and the ~6mm thickness has now been proposed by a number of dependable sources. The iPhone 17 Air is predicted to have a show that is round 6.6 inches in dimension, and it’ll additionally function a single-lens rear digicam.
The iPhone 17 Air might be considered one of three units which are set to get a {custom} Apple modem chip in 2025, with Apple additionally bringing the chip to the iPhone SE early within the yr and a low-cost iPad.
As Apple improves its modem chip design, the saved house may permit for “new designs” comparable to a foldable iPhone. In response to Gurman, Apple is constant to discover foldable iPhone expertise. Apple is aiming to part out Qualcomm modems throughout a three-year interval as Apple introduces more and more extra highly effective modem chips.
Finally, Apple may debut a system-on-a-chip that features a processor, modem, Wi-Fi chip, and different components, which might save extra house and permit for tighter integration between {hardware} parts.
This articles is written by : Nermeen Nabil Khear Abdelmalak
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